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Chemical content 74AHCT04BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT04BQ-Q100SOT762-1DHVQFN1417.64253 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935301378115412601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0560780.100000.31781
PolymerResin systemProprietary0.0139319.900000.07896
subTotal0.07000100.000000.39677
DieDoped siliconSilicon (Si)7440-21-30.29684100.000001.68254
subTotal0.29684100.000001.68254
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.3550497.4700036.02116
Iron (Fe)7439-89-60.156482.400000.88695
Phosphorus (P)7723-14-00.001960.030000.01109
Zinc (Zn)7440-66-60.006520.100000.03696
subTotal6.52000100.0000036.95616
Mould CompoundFillerSilica -amorphous-7631-86-90.836307.980004.74027
Silica fused60676-86-08.3936480.0920047.57618
PigmentCarbon black1333-86-40.097250.928000.55125
PolymerEpoxy resin systemProprietary0.885568.450005.01946
Phenolic resinProprietary0.267242.550001.51475
subTotal10.48000100.0000059.40191
Pre-PlatingPure metal layerGold (Au)7440-57-50.006603.000000.03741
Nickel (Ni)7440-02-00.2030692.300001.15097
Palladium (Pd)7440-05-30.006823.100000.03866
Silver (Ag)7440-22-40.003521.600000.01995
subTotal0.22000100.000001.24699
WirePure metalCopper (Cu)7440-50-80.05569100.000000.31566
subTotal0.05569100.000000.31566
total17.64253100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.