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Chemical content 74AHCT04BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT04BQ-Q100SOT762-1DHVQFN1418.18750 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935301378115512601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10244
PolymerResin systemProprietary0.0046319.900000.02545
subTotal0.02326100.000000.12789
DieDoped siliconSilicon (Si)7440-21-30.21203100.000001.16580
subTotal0.21203100.000001.16580
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.08431
Iron (Fe)7439-89-60.166072.400000.91313
Phosphorus (P)7723-14-00.002080.030000.01141
Zinc (Zn)7440-66-60.006920.100000.03805
subTotal6.91978100.0000038.04690
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.68320
FillerSilica -amorphous-7631-86-90.367153.490002.01869
Silica fused60676-86-08.9230784.8200049.06157
PigmentCarbon black1333-86-40.016830.160000.09255
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62469
Epoxy resin systemProprietary0.167271.590000.91969
Phenolic resinProprietary0.236702.250001.30144
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.14015
subTotal10.52001100.0000057.84198
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07611
Nickel (Ni)7440-02-00.4258792.300002.34157
Palladium (Pd)7440-05-30.014303.100000.07864
Silver (Ag)7440-22-40.007381.600000.04059
subTotal0.46140100.000002.53691
WirePure metalCopper (Cu)7440-50-80.0492696.550000.27087
Pure metal layerGold (Au)7440-57-50.000180.350000.00098
Palladium (Pd)7440-05-30.001583.100000.00870
subTotal0.05102100.000000.28055
total18.18750100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.