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Chemical content 74AHCT157BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT157BQ-Q100SOT763-1DHVQFN1621.68040 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353006881155126030 s123520 s3Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001001.000000.00460
FillerSilver (Ag)7440-22-40.0747675.000000.34483
PolymerAcrylic resinProprietary0.005986.000000.02759
Resin systemProprietary0.0179418.000000.08276
subTotal0.09968100.000000.45978
DieDoped siliconSilicon (Si)7440-21-30.35621100.000001.64301
subTotal0.35621100.000001.64301
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.78287
Iron (Fe)7439-89-60.196362.400000.90570
Phosphorus (P)7723-14-00.002450.030000.01132
Zinc (Zn)7440-66-60.008180.100000.03774
subTotal8.18167100.0000037.73763
Mould CompoundAdditiveNon hazardousProprietary0.371162.984001.71198
FillerSilica -amorphous-7631-86-90.434103.490002.00228
Silica fused60676-86-010.5503184.8200048.66289
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.124631.002000.57487
PigmentCarbon black1333-86-40.020400.164000.09409
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.460353.701002.12334
Epoxy resin systemProprietary0.197271.586000.90992
Phenolic resinProprietary0.280242.253001.29259
subTotal12.43847100.0000057.37196
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07548
Nickel (Ni)7440-02-00.5035192.300002.32240
Palladium (Pd)7440-05-30.016913.100000.07800
Silver (Ag)7440-22-40.008731.600000.04026
subTotal0.54551100.000002.51614
WirePure metalCopper (Cu)7440-50-80.0568396.550000.26214
Pure metal layerGold (Au)7440-57-50.000210.350000.00095
Palladium (Pd)7440-05-30.001823.100000.00842
subTotal0.05886100.000000.27151
total21.68040100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.