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Chemical content 74AHCT1G17GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT1G17GW-Q100SOT353-1UMT55.65482 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935308523125712601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.12892
PolymerResin systemProprietary0.0024325.000000.04297
subTotal0.00972100.000000.17189
DieDoped siliconSilicon (Si)7440-21-30.06536100.000001.15577
subTotal0.06536100.000001.15577
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400033.73667
Iron (Fe)7439-89-60.045512.310000.80475
Lead (Pb)7439-92-10.000200.010000.00348
Phosphorus (P)7723-14-00.001380.070000.02439
Zinc (Zn)7440-66-60.002360.120000.04181
Pure metal layerSilver (Ag)7440-22-40.012800.650000.22644
subTotal1.97000100.0000034.83754
Mould CompoundFillerSilica -amorphous-7631-86-90.4606014.000008.14526
Silica fused60676-86-02.3217570.5700041.05795
PigmentCarbon black1333-86-40.006580.200000.11636
PolymerEpoxy resin systemProprietary0.305649.290005.40496
Phenolic resinProprietary0.195435.940003.45592
subTotal3.29000100.0000058.18045
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00016
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00027
Tin solderTin (Sn)7440-31-50.3099799.990005.48150
subTotal0.31000100.000005.48203
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0097499.990000.17225
subTotal0.00974100.000000.17227
total5.65482100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.