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Chemical content 74AHCT1G66GV

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Type numberPackagePackage descriptionTotal product weight
74AHCT1G66GVSOT753SO510.40296 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352716681251812601235Bangkok, Thailand; Hsin-chu, Taiwan; Seremban, Malaysia; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0075075.000000.07209
PolymerResin systemProprietary0.0025025.000000.02403
subTotal0.01000100.000000.09612
DieDoped siliconSilicon (Si)7440-21-30.08038100.000000.77271
subTotal0.08038100.000000.77271
Lead FrameCopper alloyCopper (Cu)7440-50-83.1906694.9600030.67066
Iron (Fe)7439-89-60.085682.550000.82361
Lead (Pb)7439-92-10.001010.030000.00969
Phosphorus (P)7723-14-00.005040.150000.04845
Tin (Sn)7440-31-50.006720.200000.06460
Pure metal layerSilver (Ag)7440-22-40.070902.110000.68150
subTotal3.36000100.0000032.29851
Mould CompoundFillerSilica fused60676-86-04.6008071.0000044.22587
PigmentCarbon black1333-86-40.019440.300000.18687
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2765619.7000012.27112
Phenolic resinProprietary0.583209.000005.60610
subTotal6.48000100.0000062.28996
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00013
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000020.005000.00021
Tin solderTin (Sn)7440-31-50.4399699.990004.22914
subTotal0.44000100.000004.22956
WireGold alloyGold (Au)7440-57-50.0322499.000000.30995
Palladium (Pd)7440-05-30.000331.000000.00313
subTotal0.03257100.000000.31308
total10.40296100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.