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Chemical content 74AHCT240BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT240BQ-Q100SOT764-1DHVQFN2028.37777 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935301382115512601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24071
PolymerResin systemProprietary0.0169719.900000.05980
subTotal0.08528100.000000.30051
DieDoped siliconSilicon (Si)7440-21-30.34188100.000001.20475
subTotal0.34188100.000001.20475
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.4984797.4700036.99542
Iron (Fe)7439-89-60.258502.400000.91094
Phosphorus (P)7723-14-00.003230.030000.01139
Zinc (Zn)7440-66-60.010770.100000.03796
subTotal10.77098100.0000037.95571
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.67917
FillerSilica -amorphous-7631-86-90.571483.490002.01385
Silica fused60676-86-013.8892184.8200048.94397
PigmentCarbon black1333-86-40.026200.160000.09233
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62320
Epoxy resin systemProprietary0.260361.590000.91748
Phenolic resinProprietary0.368442.250001.29833
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.13502
subTotal16.37492100.0000057.70335
Pre-PlatingPure metal layerGold (Au)7440-57-50.021543.000000.07592
Nickel (Ni)7440-02-00.6628292.300002.33572
Palladium (Pd)7440-05-30.022263.100000.07845
Silver (Ag)7440-22-40.011491.600000.04049
subTotal0.71812100.000002.53058
WirePure metalCopper (Cu)7440-50-80.0836096.550000.29461
Pure metal layerGold (Au)7440-57-50.000300.350000.00107
Palladium (Pd)7440-05-30.002683.100000.00946
subTotal0.08659100.000000.30514
total28.37777100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.