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Chemical content 74AHCT244BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT244BQ-Q100SOT764-1DHVQFN2028.37571 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298436115512601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24073
PolymerResin systemProprietary0.0169719.900000.05981
subTotal0.08528100.000000.30054
DieDoped siliconSilicon (Si)7440-21-30.33954100.000001.19658
subTotal0.33954100.000001.19658
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.4984797.4700036.99810
Iron (Fe)7439-89-60.258502.400000.91100
Phosphorus (P)7723-14-00.003230.030000.01139
Zinc (Zn)7440-66-60.010770.100000.03796
subTotal10.77098100.0000037.95845
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.67929
FillerSilica -amorphous-7631-86-90.571483.490002.01399
Silica fused60676-86-013.8892184.8200048.94752
PigmentCarbon black1333-86-40.026200.160000.09233
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62324
Epoxy resin systemProprietary0.260361.590000.91755
Phenolic resinProprietary0.368442.250001.29842
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.13518
subTotal16.37492100.0000057.70752
Pre-PlatingPure metal layerGold (Au)7440-57-50.021543.000000.07592
Nickel (Ni)7440-02-00.6628292.300002.33589
Palladium (Pd)7440-05-30.022263.100000.07845
Silver (Ag)7440-22-40.011491.600000.04049
subTotal0.71812100.000002.53075
WirePure metalCopper (Cu)7440-50-80.0838796.550000.29558
Pure metal layerGold (Au)7440-57-50.000300.350000.00107
Palladium (Pd)7440-05-30.002693.100000.00949
subTotal0.08687100.000000.30614
total28.37571100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.