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Chemical content 74AHCT245BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT245BQ-Q100SOT764-1DHVQFN2028.52931 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300202115512601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.23944
PolymerResin systemProprietary0.0169719.900000.05949
subTotal0.08528100.000000.29893
DieDoped siliconSilicon (Si)7440-21-30.49877100.000001.74828
subTotal0.49877100.000001.74828
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.4984797.4700036.79891
Iron (Fe)7439-89-60.258502.400000.90610
Phosphorus (P)7723-14-00.003230.030000.01133
Zinc (Zn)7440-66-60.010770.100000.03775
subTotal10.77098100.0000037.75409
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.67025
FillerSilica -amorphous-7631-86-90.571483.490002.00315
Silica fused60676-86-013.8892184.8200048.68399
PigmentCarbon black1333-86-40.026200.160000.09183
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.61989
Epoxy resin systemProprietary0.260361.590000.91261
Phenolic resinProprietary0.368442.250001.29143
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.12368
subTotal16.37492100.0000057.39683
Pre-PlatingPure metal layerGold (Au)7440-57-50.021543.000000.07551
Nickel (Ni)7440-02-00.6628292.300002.32331
Palladium (Pd)7440-05-30.022263.100000.07803
Silver (Ag)7440-22-40.011491.600000.04027
subTotal0.71812100.000002.51712
WirePure metalCopper (Cu)7440-50-80.0784496.550000.27493
Pure metal layerGold (Au)7440-57-50.000280.350000.00100
Palladium (Pd)7440-05-30.002523.100000.00883
subTotal0.08124100.000000.28476
total28.52931100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.