Chemical content 74AHCT273BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT273BQ-Q100SOT764-1DHVQFN2028.02589 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300205115512601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24374
PolymerResin systemProprietary0.0169719.900000.06055
DieDoped siliconSilicon (Si)7440-21-30.33908100.000001.20990
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5889697.4700037.78276
Iron (Fe)7439-89-60.260732.400000.93032
Phosphorus (P)7723-14-00.003260.030000.01163
Zinc (Zn)7440-66-60.010860.100000.03876
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.70025
FillerSilica -amorphous-7631-86-90.571483.490002.03913
Silica fused60676-86-013.8892184.8200049.55849
PigmentCarbon black1333-86-40.026200.160000.09348
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.63102
Epoxy resin systemProprietary0.260361.590000.92900
Phenolic resinProprietary0.368442.250001.31463
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.16183
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00984
Nickel (Ni)7440-02-00.2509691.000000.89546
Palladium (Pd)7440-05-30.022068.000000.07872
WirePure metalCopper (Cu)7440-50-80.0840196.550000.29976
Pure metal layerGold (Au)7440-57-50.000300.350000.00109
Palladium (Pd)7440-05-30.002703.100000.00962
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.