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Chemical content 74AHCT30BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT30BQ-Q100SOT762-1DHVQFN1418.12189 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935301385115512601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10281
PolymerResin systemProprietary0.0046319.900000.02554
subTotal0.02326100.000000.12835
DieDoped siliconSilicon (Si)7440-21-30.15647100.000000.86344
subTotal0.15647100.000000.86344
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.21858
Iron (Fe)7439-89-60.166072.400000.91643
Phosphorus (P)7723-14-00.002080.030000.01146
Zinc (Zn)7440-66-60.006920.100000.03818
subTotal6.91978100.0000038.18465
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.68930
FillerSilica -amorphous-7631-86-90.367153.490002.02599
Silica fused60676-86-08.9230784.8200049.23919
PigmentCarbon black1333-86-40.016830.160000.09288
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62696
Epoxy resin systemProprietary0.167271.590000.92302
Phenolic resinProprietary0.236702.250001.30616
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.14790
subTotal10.52001100.0000058.05140
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07638
Nickel (Ni)7440-02-00.4258792.300002.35004
Palladium (Pd)7440-05-30.014303.100000.07893
Silver (Ag)7440-22-40.007381.600000.04074
subTotal0.46140100.000002.54609
WirePure metalCopper (Cu)7440-50-80.0395596.550000.21825
Pure metal layerGold (Au)7440-57-50.000140.350000.00079
Palladium (Pd)7440-05-30.001273.100000.00701
subTotal0.04096100.000000.22605
total18.12189100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.