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Chemical content 74AHCT30BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT30BQ-Q100SOT762-1DHVQFN1417.55795 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935301385115412601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0560780.100000.31934
PolymerResin systemProprietary0.0139319.900000.07934
subTotal0.07000100.000000.39868
DieDoped siliconSilicon (Si)7440-21-30.21906100.000001.24764
subTotal0.21906100.000001.24764
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.3550497.4700036.19468
Iron (Fe)7439-89-60.156482.400000.89122
Phosphorus (P)7723-14-00.001960.030000.01114
Zinc (Zn)7440-66-60.006520.100000.03713
subTotal6.52000100.0000037.13417
Mould CompoundFillerSilica -amorphous-7631-86-90.836307.980004.76311
Silica fused60676-86-08.3936480.0920047.80536
PigmentCarbon black1333-86-40.097250.928000.55391
PolymerEpoxy resin systemProprietary0.885568.450005.04364
Phenolic resinProprietary0.267242.550001.52205
subTotal10.48000100.0000059.68807
Pre-PlatingPure metal layerGold (Au)7440-57-50.006603.000000.03759
Nickel (Ni)7440-02-00.2030692.300001.15651
Palladium (Pd)7440-05-30.006823.100000.03884
Silver (Ag)7440-22-40.003521.600000.02005
subTotal0.22000100.000001.25299
WirePure metalCopper (Cu)7440-50-80.04889100.000000.27845
subTotal0.04889100.000000.27845
total17.55795100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.