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Chemical content 74AHCT30BQ

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Type numberPackagePackage descriptionTotal product weight
74AHCT30BQSOT762-1DHVQFN1417.96000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935289765115912601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10374
PolymerResin systemProprietary0.0046319.900000.02577
subTotal0.02326100.000000.12951
DieDoped siliconSilicon (Si)7440-21-30.21906100.000001.21971
subTotal0.21906100.000001.21971
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8029797.4700037.87846
Iron (Fe)7439-89-60.167512.400000.93268
Phosphorus (P)7723-14-00.002090.030000.01166
Zinc (Zn)7440-66-60.006980.100000.03886
subTotal6.97956100.0000038.86166
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.70452
FillerSilica -amorphous-7631-86-90.367153.490002.04425
Silica fused60676-86-08.9230684.8200049.68298
PigmentCarbon black1333-86-40.016830.160000.09372
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.63261
Epoxy resin systemProprietary0.167271.590000.93134
Phenolic resinProprietary0.236702.250001.31793
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.16726
subTotal10.52000100.0000058.57461
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00987
Nickel (Ni)7440-02-00.1612391.000000.89772
Palladium (Pd)7440-05-30.014178.000000.07892
subTotal0.17718100.000000.98651
WirePure metalCopper (Cu)7440-50-80.0395496.550000.22014
Pure metal layerGold (Au)7440-57-50.000140.350000.00080
Palladium (Pd)7440-05-30.001273.100000.00707
subTotal0.04095100.000000.22801
total17.96000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.