Chemical content 74AHCT573BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT573BQ-Q100SOT764-1DHVQFN2028.45299 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300318115512601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24008
PolymerResin systemProprietary0.0169719.900000.05964
DieDoped siliconSilicon (Si)7440-21-30.41961100.000001.47475
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.4984797.4700036.89761
Iron (Fe)7439-89-60.258502.400000.90853
Phosphorus (P)7723-14-00.003230.030000.01136
Zinc (Zn)7440-66-60.010770.100000.03786
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.67473
FillerSilica -amorphous-7631-86-90.571483.490002.00852
Silica fused60676-86-013.8892184.8200048.81458
PigmentCarbon black1333-86-40.026200.160000.09208
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62155
Epoxy resin systemProprietary0.260361.590000.91506
Phenolic resinProprietary0.368442.250001.29489
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.12938
Pre-PlatingPure metal layerGold (Au)7440-57-50.021543.000000.07572
Nickel (Ni)7440-02-00.6628292.300002.32954
Palladium (Pd)7440-05-30.022263.100000.07824
Silver (Ag)7440-22-40.011491.600000.04038
WirePure metalCopper (Cu)7440-50-80.0811796.550000.28530
Pure metal layerGold (Au)7440-57-50.000290.350000.00103
Palladium (Pd)7440-05-30.002613.100000.00916
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.