Chemical content 74AHCT574BQ

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Type numberPackagePackage descriptionTotal product weight
74AHCT574BQSOT764-1DHVQFN2028.26817 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352855491151212601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24165
PolymerResin systemProprietary0.0169719.900000.06003
DieDoped siliconSilicon (Si)7440-21-30.58408100.000002.06620
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.45966
Iron (Fe)7439-89-60.260742.400000.92237
Phosphorus (P)7723-14-00.003260.030000.01153
Zinc (Zn)7440-66-60.010860.100000.03843
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.68568
FillerSilica -amorphous-7631-86-90.571483.490002.02165
Silica fused60676-86-013.8892084.8200049.13370
PigmentCarbon black1333-86-40.026200.160000.09268
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62561
Epoxy resin systemProprietary0.260361.590000.92104
Phenolic resinProprietary0.368442.250001.30336
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.14330
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00976
Nickel (Ni)7440-02-00.2509591.000000.88775
Palladium (Pd)7440-05-30.022068.000000.07804
WirePure metalCopper (Cu)7440-50-80.0812196.550000.28728
Pure metal layerGold (Au)7440-57-50.000290.350000.00104
Palladium (Pd)7440-05-30.002613.100000.00922
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.