Chemical content 74AHCT574D

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Type numberPackagePackage descriptionTotal product weight
74AHCT574DSOT163-1SO20520.86611 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352630821181112601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-43.4821377.900000.66853
PolymerAcrylic resinProprietary0.6794415.200000.13044
Resin systemProprietary0.308436.900000.05921
DieDoped siliconSilicon (Si)7440-21-30.58408100.000000.11214
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-8152.5600497.4700029.28969
Iron (Fe)7439-89-63.756482.400000.72120
Phosphorus (P)7723-14-00.046960.030000.00901
Zinc (Zn)7440-66-60.156520.100000.03005
Mould CompoundAdditiveNon hazardousProprietary16.846214.700003.23427
FillerSilica fused60676-86-0283.1597079.0000054.36324
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-821.505806.000004.12885
PigmentCarbon black1333-86-40.716860.200000.13763
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-614.337204.000002.75257
Non hazardousProprietary14.695634.100002.82138
Tetramethylbiphenyl diglycidyl ether85954-11-67.168602.000001.37628
Pre-PlatingPure metal layerGold (Au)7440-57-50.019503.000000.00374
Nickel (Ni)7440-02-00.5999592.300000.11518
Palladium (Pd)7440-05-30.020153.100000.00387
Silver (Ag)7440-22-40.010401.600000.00200
WirePure metalCopper (Cu)7440-50-80.21204100.000000.04071
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.