×

Chemical content 74AHCT594BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AHCT594BQ-Q100SOT763-1DHVQFN1621.71197 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298655115512601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.36774
PolymerResin systemProprietary0.0198419.900000.09136
subTotal0.09968100.000000.45910
DieDoped siliconSilicon (Si)7440-21-30.38781100.000001.78614
subTotal0.38781100.000001.78614
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.72939
Iron (Fe)7439-89-60.196362.400000.90439
Phosphorus (P)7723-14-00.002450.030000.01130
Zinc (Zn)7440-66-60.008180.100000.03768
subTotal8.18167100.0000037.68276
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.66710
FillerSilica -amorphous-7631-86-90.434103.490001.99937
Silica fused60676-86-010.5503184.8200048.59214
PigmentCarbon black1333-86-40.019900.160000.09166
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61872
Epoxy resin systemProprietary0.197771.590000.91089
Phenolic resinProprietary0.279872.250001.28899
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.11968
subTotal12.43847100.0000057.28855
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07537
Nickel (Ni)7440-02-00.5035192.300002.31902
Palladium (Pd)7440-05-30.016913.100000.07789
Silver (Ag)7440-22-40.008731.600000.04020
subTotal0.54551100.000002.51248
WirePure metalCopper (Cu)7440-50-80.0568096.550000.26161
Pure metal layerGold (Au)7440-57-50.000210.350000.00095
Palladium (Pd)7440-05-30.001823.100000.00840
subTotal0.05883100.000000.27096
total21.71197100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.