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Chemical content 74AHCT594BQ

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Type numberPackagePackage descriptionTotal product weight
74AHCT594BQSOT763-1DHVQFN1622.06464 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352820171151312601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29405
PolymerResin systemProprietary0.0161219.900000.07305
subTotal0.08100100.000000.36710
DieDoped siliconSilicon (Si)7440-21-30.38781100.000001.75759
subTotal0.38781100.000001.75759
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.50745
Iron (Fe)7439-89-60.237082.320001.07448
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03705
Zinc (Zn)7440-66-60.012260.120000.05558
Gold alloyGold (Au)7440-57-50.003060.029970.01388
Silver (Ag)7440-22-40.002040.019980.00925
ImpurityNon hazardousProprietary0.000130.001280.00059
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02313
Nickel (Ni)7440-02-00.130671.278720.59223
subTotal10.21900100.0000046.31387
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.49268
FillerSilica -amorphous-7631-86-90.395003.490001.79019
Silica fused60676-86-09.5999384.8200043.50820
PigmentCarbon black1333-86-40.018110.160000.08207
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55398
Epoxy resin systemProprietary0.179961.590000.81559
Phenolic resinProprietary0.254662.250001.15413
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.89791
subTotal11.31800100.0000051.29475
WirePure metalCopper (Cu)7440-50-80.0568096.550000.25743
Pure metal layerGold (Au)7440-57-50.000210.350000.00093
Palladium (Pd)7440-05-30.001823.100000.00827
subTotal0.05883100.000000.26663
total22.06464100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.