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Chemical content 74AHCU04BQ

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Type numberPackagePackage descriptionTotal product weight
74AHCU04BQSOT762-1DHVQFN1421.82689 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352855511151312601235Nijmegen, Netherlands; Suzhou, China; Hsin-chu, Taiwan; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0945280.100000.43303
PolymerResin systemProprietary0.0234819.900000.10758
subTotal0.11800100.000000.54061
DieDoped siliconSilicon (Si)7440-21-30.21203100.000000.97142
subTotal0.21203100.000000.97142
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.60688
Iron (Fe)7439-89-60.205522.346100.94158
Phosphorus (P)7723-14-00.002650.030200.01212
Zinc (Zn)7440-66-60.008890.101500.04074
Pure metal layerGold (Au)7440-57-50.002650.030200.01212
Nickel (Ni)7440-02-00.106921.220500.48984
Palladium (Pd)7440-05-30.004910.056000.02248
Silver (Ag)7440-22-40.001800.020500.00823
subTotal8.76000100.0000040.13399
Mould CompoundAdditiveNon hazardousProprietary0.369162.910001.69132
FillerSilica -amorphous-7631-86-90.442743.490002.02842
Silica fused60676-86-010.7602784.8200049.29821
PigmentCarbon black1333-86-40.020300.160000.09299
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.137011.080000.62771
Epoxy resin systemProprietary0.201711.590000.92412
Phenolic resinProprietary0.285442.250001.30772
Tetramethylbiphenyl diglycidyl ether85954-11-60.469383.700002.15048
subTotal12.68600100.0000058.12097
WirePure metalCopper (Cu)7440-50-80.0491196.550000.22500
Pure metal layerGold (Au)7440-57-50.000180.350000.00082
Palladium (Pd)7440-05-30.001583.100000.00722
subTotal0.05086100.000000.23304
total21.82689100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.