×

Chemical content 74ALVT162827DGG

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74ALVT162827DGGSOT364-1TSSOP56231.43132 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935210070518812601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
9352100701182012601235D-22529 HAMBURG, Germany; Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1947577.900000.08415
PolymerAcrylic resinProprietary0.0380015.200000.01642
Resin systemProprietary0.017256.900000.00745
subTotal0.25000100.000000.10802
DieDoped siliconSilicon (Si)7440-21-31.67197100.000000.72245
subTotal1.67197100.000000.72245
Lead FrameCopper alloyCopper (Cu)7440-50-887.7275994.5850037.90653
Magnesium (Mg)7439-95-40.159530.172000.06893
Silicon (Si)7440-21-30.660840.712500.28555
Pure metal layerGold (Au)7440-57-50.027360.029500.01182
Nickel (Ni)7440-02-04.109294.430501.77560
Palladium (Pd)7440-05-30.045450.049000.01964
Silver (Ag)7440-22-40.019940.021500.00862
subTotal92.75000100.0000040.07669
Mould CompoundAdditiveNon hazardousProprietary6.406104.700002.76804
FillerSilica fused60676-86-0107.6770079.0000046.52655
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-88.178006.000003.53366
PigmentCarbon black1333-86-40.272600.200000.11779
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-65.452004.000002.35577
Non hazardousProprietary5.588304.100002.41467
Tetramethylbiphenyl diglycidyl ether85954-11-62.726002.000001.17789
subTotal136.30000100.0000058.89437
WirePure metalCopper (Cu)7440-50-80.45935100.000000.19848
subTotal0.45935100.000000.19848
total231.43132100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.