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Chemical content 74AUP1G00GW

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Type numberPackagePackage descriptionTotal product weight
74AUP1G00GWSOT353-1UMT56.57063 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352789981251512601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0075075.000000.11414
PolymerResin systemProprietary0.0025025.000000.03805
subTotal0.01000100.000000.15219
DieDoped siliconSilicon (Si)7440-21-31.15717100.0000017.61127
subTotal1.15717100.0000017.61127
Lead FrameCopper alloyCopper (Cu)7440-50-81.9034196.6200028.96852
Iron (Fe)7439-89-60.041962.130000.63861
Phosphorus (P)7723-14-00.000590.030000.00899
Zinc (Zn)7440-66-60.002560.130000.03898
MetallisationSilver (Ag)7440-22-40.021471.090000.32680
subTotal1.97000100.0000029.98190
Mould CompoundAdditiveNon hazardousProprietary0.090192.900001.37262
Triphenylphosphine603-35-00.001560.050000.02367
FillerSilica -amorphous-7631-86-92.2392072.0000034.07892
PigmentCarbon black1333-86-40.001560.050000.02367
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4665015.000007.09978
Phenol Formaldehyde resin (generic)9003-35-40.3110010.000004.73318
subTotal3.11000100.0000047.33184
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00014
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00024
Tin solderTin (Sn)7440-31-50.3099799.990004.71749
subTotal0.31000100.000004.71797
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0134699.990000.20487
subTotal0.01346100.000000.20489
total6.57063100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.