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Chemical content 74AUP1G02GX

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Type numberPackagePackage descriptionTotal product weight
74AUP1G02GXSOT1226-3X2SON50.60059 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298354125712601235Shanghai, China; Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02051100.000003.41563
subTotal0.02051100.000003.41563
ComponentAdditiveNon hazardousProprietary0.000205.000000.03330
FillerBisphenol A-epichlorohydrin resin25068-38-60.000205.000000.03330
Silica -amorphous-7631-86-90.0020050.000000.33301
PolymerEpoxy resin systemProprietary0.0012030.000000.19980
Phenol Formaldehyde resin (generic)9003-35-40.0004010.000000.06660
subTotal0.00400100.000000.66601
Lead FrameCopper alloyCopper (Cu)7440-50-80.2391194.5100039.81257
Magnesium (Mg)7439-95-40.000380.150000.06319
Nickel (Ni)7440-02-00.007462.950001.24269
Silicon (Si)7440-21-30.001620.640000.26960
Pure metal layerGold (Au)7440-57-50.000050.020000.00843
Nickel (Ni)7440-02-00.004151.640000.69085
Palladium (Pd)7440-05-30.000230.090000.03791
subTotal0.25300100.0000042.12524
Mould CompoundAdditiveNon hazardousProprietary0.001280.410000.21299
FillerSilica -amorphous-7631-86-90.000900.290000.15065
Silica fused60676-86-00.2687986.1500044.75399
HardenerPhenolic resinProprietary0.013384.290002.22861
PigmentCarbon black1333-86-40.000590.190000.09870
PolymerEpoxy resin systemProprietary0.027058.670004.50397
subTotal0.31200100.0000051.94891
WireGold alloyGold (Au)7440-57-50.0109799.000001.82642
Palladium (Pd)7440-05-30.000111.000000.01845
subTotal0.01108100.000001.84487
total0.60059100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.