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Chemical content 74AUP1G07GX

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Type numberPackagePackage descriptionTotal product weight
74AUP1G07GXSOT1226-3X2SON50.61173 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352979261251012601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03146100.000005.14197
subTotal0.03146100.000005.14197
ComponentAdditiveNon hazardousProprietary0.000205.000000.03269
FillerBisphenol A-epichlorohydrin resin25068-38-60.000205.000000.03269
Silica -amorphous-7631-86-90.0020050.000000.32694
PolymerEpoxy resin systemProprietary0.0012030.000000.19616
Phenol Formaldehyde resin (generic)9003-35-40.0004010.000000.06539
subTotal0.00400100.000000.65387
Lead FrameCopper alloyCopper (Cu)7440-50-80.2391194.5100039.08755
Magnesium (Mg)7439-95-40.000380.150000.06204
Nickel (Ni)7440-02-00.007462.950001.22006
Silicon (Si)7440-21-30.001620.640000.26469
Pure metal layerGold (Au)7440-57-50.000050.020000.00827
Nickel (Ni)7440-02-00.004151.640000.67827
Palladium (Pd)7440-05-30.000230.090000.03722
subTotal0.25300100.0000041.35810
Mould CompoundAdditiveNon hazardousProprietary0.001280.410000.20911
FillerSilica -amorphous-7631-86-90.000900.290000.14791
Silica fused60676-86-00.2687986.1500043.93899
HardenerPhenolic resinProprietary0.013384.290002.18802
PigmentCarbon black1333-86-40.000590.190000.09691
PolymerEpoxy resin systemProprietary0.027058.670004.42195
subTotal0.31200100.0000051.00289
WireGold alloyGold (Au)7440-57-50.0111699.000001.82389
Palladium (Pd)7440-05-30.000111.000000.01842
subTotal0.01127100.000001.84231
total0.61173100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.