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Chemical content 74AUP1G08GX

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Type numberPackagePackage descriptionTotal product weight
74AUP1G08GXSOT1226-3X2SON50.60057 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298227125812601235Shanghai, China; Bangkok, Thailand; Seremban, Malaysia; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02051100.000003.41574
subTotal0.02051100.000003.41574
ComponentAdditiveNon hazardousProprietary0.000205.000000.03330
FillerBisphenol A-epichlorohydrin resin25068-38-60.000205.000000.03330
Silica -amorphous-7631-86-90.0020050.000000.33302
PolymerEpoxy resin systemProprietary0.0012030.000000.19981
Phenol Formaldehyde resin (generic)9003-35-40.0004010.000000.06660
subTotal0.00400100.000000.66603
Lead FrameCopper alloyCopper (Cu)7440-50-80.2391194.5100039.81389
Magnesium (Mg)7439-95-40.000380.150000.06319
Nickel (Ni)7440-02-00.007462.950001.24274
Silicon (Si)7440-21-30.001620.640000.26961
Pure metal layerGold (Au)7440-57-50.000050.020000.00843
Nickel (Ni)7440-02-00.004151.640000.69088
Palladium (Pd)7440-05-30.000230.090000.03791
subTotal0.25300100.0000042.12665
Mould CompoundAdditiveNon hazardousProprietary0.001280.410000.21300
FillerSilica -amorphous-7631-86-90.000900.290000.15066
Silica fused60676-86-00.2687986.1500044.75548
HardenerPhenolic resinProprietary0.013384.290002.22868
PigmentCarbon black1333-86-40.000590.190000.09871
PolymerEpoxy resin systemProprietary0.027058.670004.50412
subTotal0.31200100.0000051.95065
WireGold alloyGold (Au)7440-57-50.0109599.000001.82329
Palladium (Pd)7440-05-30.000111.000000.01842
subTotal0.01106100.000001.84171
total0.60057100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.