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Chemical content 74AUP1G126GX

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Type numberPackagePackage descriptionTotal product weight
74AUP1G126GXSOT1226-3X2SON50.60383 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298369125912601235Seremban, Malaysia; Shanghai, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02051100.000003.39730
subTotal0.02051100.000003.39730
ComponentAdditiveNon hazardousProprietary0.000205.000000.03312
FillerBisphenol A-epichlorohydrin resin25068-38-60.000205.000000.03312
Silica -amorphous-7631-86-90.0020050.000000.33122
PolymerEpoxy resin systemProprietary0.0012030.000000.19873
Phenol Formaldehyde resin (generic)9003-35-40.0004010.000000.06624
subTotal0.00400100.000000.66243
Lead FrameCopper alloyCopper (Cu)7440-50-80.2391194.5100039.59894
Magnesium (Mg)7439-95-40.000380.150000.06285
Nickel (Ni)7440-02-00.007462.950001.23603
Silicon (Si)7440-21-30.001620.640000.26815
Pure metal layerGold (Au)7440-57-50.000050.020000.00838
Nickel (Ni)7440-02-00.004151.640000.68715
Palladium (Pd)7440-05-30.000230.090000.03771
subTotal0.25300100.0000041.89921
Mould CompoundAdditiveNon hazardousProprietary0.001280.410000.21185
FillerSilica -amorphous-7631-86-90.000900.290000.14984
Silica fused60676-86-00.2687986.1500044.51385
HardenerPhenolic resinProprietary0.013384.290002.21665
PigmentCarbon black1333-86-40.000590.190000.09817
PolymerEpoxy resin systemProprietary0.027058.670004.47980
subTotal0.31200100.0000051.67016
WireGold alloyGold (Au)7440-57-50.0141899.000002.34781
Palladium (Pd)7440-05-30.000141.000000.02372
subTotal0.01432100.000002.37153
total0.60383100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.