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Chemical content 74AUP1G132GX

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Type numberPackagePackage descriptionTotal product weight
74AUP1G132GXSOT1226-3X2SON50.61410 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298371125612601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03146100.000005.12213
subTotal0.03146100.000005.12213
ComponentAdditiveNon hazardousProprietary0.000205.000000.03257
FillerBisphenol A-epichlorohydrin resin25068-38-60.000205.000000.03257
Silica -amorphous-7631-86-90.0020050.000000.32568
PolymerEpoxy resin systemProprietary0.0012030.000000.19541
Phenol Formaldehyde resin (generic)9003-35-40.0004010.000000.06514
subTotal0.00400100.000000.65137
Lead FrameCopper alloyCopper (Cu)7440-50-80.2391194.5100038.93670
Magnesium (Mg)7439-95-40.000380.150000.06180
Nickel (Ni)7440-02-00.007462.950001.21536
Silicon (Si)7440-21-30.001620.640000.26367
Pure metal layerGold (Au)7440-57-50.000050.020000.00824
Nickel (Ni)7440-02-00.004151.640000.67566
Palladium (Pd)7440-05-30.000230.090000.03708
subTotal0.25300100.0000041.19851
Mould CompoundAdditiveNon hazardousProprietary0.001280.410000.20830
FillerSilica -amorphous-7631-86-90.000900.290000.14734
Silica fused60676-86-00.2687986.1500043.76942
HardenerPhenolic resinProprietary0.013384.290002.17958
PigmentCarbon black1333-86-40.000590.190000.09653
PolymerEpoxy resin systemProprietary0.027058.670004.40489
subTotal0.31200100.0000050.80606
WireGold alloyGold (Au)7440-57-50.0135399.000002.20376
Palladium (Pd)7440-05-30.000141.000000.02226
subTotal0.01367100.000002.22602
total0.61410100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.