Chemical content 74AUP1G158GM

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Type numberPackagePackage descriptionTotal product weight
74AUP1G158GMSOT886XSON61.95267 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352799731321412601235Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands 
9352799731151212601235Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped SiliconSilicon (Si)7440-21-30.08414100.000004.30908
ComponentAdditiveNon hazardousProprietary0.000255.000000.01280
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01280
Silica -amorphous-7631-86-90.0025050.000000.12803
PolymerEpoxy resin systemProprietary0.0015030.000000.07682
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02561
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100037.36511
Magnesium (Mg)7439-95-40.001160.150000.05930
Nickel (Ni)7440-02-00.022772.950001.16630
Silicon (Si)7440-21-30.004940.640000.25303
Pure metal layerGold (Au)7440-57-50.000150.020000.00791
Nickel (Ni)7440-02-00.012661.640000.64838
Palladium (Pd)7440-05-30.000690.090000.03558
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22383
FillerSilica -amorphous-7631-86-90.003090.290000.15832
Silica fused60676-86-00.9183686.1500047.03094
HardenerPhenolic resinProprietary0.045734.290002.34199
PigmentCarbon black1333-86-40.002030.190000.10372
PolymerEpoxy resin systemProprietary0.092428.670004.73312
WireGold alloyGold (Au)7440-57-50.0252799.000001.29411
Palladium (Pd)7440-05-30.000261.000000.01307
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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