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Chemical content 74AUP1G158GM

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Type numberPackagePackage descriptionTotal product weight
74AUP1G158GMSOT886XSON61.95267 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352799731321412601235Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands 
9352799731151212601235Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped SiliconSilicon (Si)7440-21-30.08414100.000004.30908
subTotal0.08414100.000004.30908
ComponentAdditiveNon hazardousProprietary0.000255.000000.01280
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01280
Silica -amorphous-7631-86-90.0025050.000000.12803
PolymerEpoxy resin systemProprietary0.0015030.000000.07682
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02561
subTotal0.00500100.000000.25606
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100037.36511
Magnesium (Mg)7439-95-40.001160.150000.05930
Nickel (Ni)7440-02-00.022772.950001.16630
Silicon (Si)7440-21-30.004940.640000.25303
Pure metal layerGold (Au)7440-57-50.000150.020000.00791
Nickel (Ni)7440-02-00.012661.640000.64838
Palladium (Pd)7440-05-30.000690.090000.03558
subTotal0.77200100.0000039.53561
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22383
FillerSilica -amorphous-7631-86-90.003090.290000.15832
Silica fused60676-86-00.9183686.1500047.03094
HardenerPhenolic resinProprietary0.045734.290002.34199
PigmentCarbon black1333-86-40.002030.190000.10372
PolymerEpoxy resin systemProprietary0.092428.670004.73312
subTotal1.06600100.0000054.59192
WireGold alloyGold (Au)7440-57-50.0252799.000001.29411
Palladium (Pd)7440-05-30.000261.000000.01307
subTotal0.02553100.000001.30718
total1.95267100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.