Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AUP1G16GW

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
93530753412574AUP1G16GWH74AUP1G16GWSOT353-1 (UMT5)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 39 ppm; substance 1333-86-4: 1415 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 38 ppm; substance 1333-86-4: 1414 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 3656 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.00729075.0000000.132630
AdhesivePolymerResin system0.00243025.0000000.044211
Adhesive Total0.009720100.0000000.176841
DieDoped siliconSilicon (Si)7440-21-30.083880100.0000001.526069
Die Total0.083880100.0000001.526069
Lead FrameCopper alloyCopper (Cu)7440-50-81.90774896.84000034.708576
Lead FrameCopper alloyIron (Fe)7439-89-60.0455072.3100000.827932
Lead FrameCopper alloyZinc (Zn)7440-66-60.0023640.1200000.043009
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0013790.0700000.025090
Lead FrameCopper alloyLead (Pb)7439-92-10.0001970.0100000.003584
Base Alloy Total1.95719599.35000035.608191
Lead FramePure metal layerSilver (Ag)7440-22-40.0128050.6500000.232968
Pre-Plating Total0.0128050.6500000.232968
Lead Frame Total1.970000100.00000035.841159
Mould CompoundFillerSilica fused60676-86-01.36342443.84000024.805429
Mould CompoundFillerSilica7631-86-91.09067735.07000019.843212
Mould CompoundPolymero-Cresol-epichlorohydrin-formaldehyde copolymer29690-82-20.31100010.0000005.658172
Mould CompoundPolymerFormaldehyde-phenol copolymer9003-35-40.3091349.9400005.624224
Mould CompoundPolymerPolyethylene (PE) -wax-9002-88-40.0279900.9000000.509237
Mould CompoundPigmentCarbon black1333-86-40.0077750.2500000.141455
Mould Compound Total3.110000100.00000056.581729
Post-PlatingTin solderTin (Sn)7440-31-50.30996999.9900005.639415
Post-PlatingImpurityLead (Pb)7439-92-10.0000160.0050000.000283
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000090.0030000.000169
Post-PlatingImpurityCopper (Cu)7440-50-80.0000030.0010000.000056
Post-PlatingImpurityBismuth (Bi)7440-69-90.0000030.0010000.000056
Post-Plating Total0.310000100.0000005.639979
WirePure metalCopper (Cu)7440-50-80.01287399.9900000.234204
WireImpurityNon-declarable0.0000010.0100000.000019
Wire Total0.012874100.0000000.234223
74AUP1G16GW Total5.496474100.000000100.000000
Notes
Report created on 2024-12-07 20:29:19 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-12-07 20:29:19 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
胶黏剂 (Adhesive)
半导体芯片 (Die)
基底合金 (Base Alloy)
预镀层 (Pre-Plating)
模封料 (Mould Compound)
后镀层 (Post-Plating)
导线 (Wire)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-12-07 20:29:19 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.