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Chemical content 74AUP1G17GX

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Type numberPackagePackage descriptionTotal product weight
74AUP1G17GXSOT1226-3X2SON50.61191 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298228125812601235Nijmegen, Netherlands; Seremban, Malaysia; Shanghai, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03146100.000005.14046
subTotal0.03146100.000005.14046
ComponentAdditiveNon hazardousProprietary0.000205.000000.03268
FillerBisphenol A-epichlorohydrin resin25068-38-60.000205.000000.03268
Silica -amorphous-7631-86-90.0020050.000000.32685
PolymerEpoxy resin systemProprietary0.0012030.000000.19611
Phenol Formaldehyde resin (generic)9003-35-40.0004010.000000.06537
subTotal0.00400100.000000.65369
Lead FrameCopper alloyCopper (Cu)7440-50-80.2391194.5100039.07606
Magnesium (Mg)7439-95-40.000380.150000.06202
Nickel (Ni)7440-02-00.007462.950001.21971
Silicon (Si)7440-21-30.001620.640000.26461
Pure metal layerGold (Au)7440-57-50.000050.020000.00827
Nickel (Ni)7440-02-00.004151.640000.67807
Palladium (Pd)7440-05-30.000230.090000.03721
subTotal0.25300100.0000041.34595
Mould CompoundAdditiveNon hazardousProprietary0.001280.410000.20905
FillerSilica -amorphous-7631-86-90.000900.290000.14786
Silica fused60676-86-00.2687986.1500043.92607
HardenerPhenolic resinProprietary0.013384.290002.18738
PigmentCarbon black1333-86-40.000590.190000.09688
PolymerEpoxy resin systemProprietary0.027058.670004.42065
subTotal0.31200100.0000050.98789
WireGold alloyGold (Au)7440-57-50.0113499.000001.85329
Palladium (Pd)7440-05-30.000111.000000.01872
subTotal0.01146100.000001.87201
total0.61191100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.