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Chemical content 74AUP1G19GS

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Type numberPackagePackage descriptionTotal product weight
74AUP1G19GSSOT1202X2SON60.98015 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292856132912601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04510100.000004.60164
subTotal0.04510100.000004.60164
ComponentAdditiveNon hazardousProprietary0.000255.000000.02551
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02551
Silica -amorphous-7631-86-90.0025050.000000.25506
PolymerEpoxy resin systemProprietary0.0015030.000000.15304
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05101
subTotal0.00500100.000000.51013
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100040.59451
Magnesium (Mg)7439-95-40.000630.150000.06443
Nickel (Ni)7440-02-00.012422.950001.26710
Silicon (Si)7440-21-30.002690.640000.27490
Pure metal layerGold (Au)7440-57-50.000080.020000.00859
Nickel (Ni)7440-02-00.006901.640000.70442
Palladium (Pd)7440-05-30.000380.090000.03866
subTotal0.42100100.0000042.95261
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.20539
FillerSilica -amorphous-7631-86-90.001420.290000.14527
Silica fused60676-86-00.4230086.1500043.15630
HardenerPhenolic resinProprietary0.021064.290002.14905
PigmentCarbon black1333-86-40.000930.190000.09518
PolymerEpoxy resin systemProprietary0.042578.670004.34318
subTotal0.49100100.0000050.09437
WireGold alloyGold (Au)7440-57-50.0178799.000001.82314
Palladium (Pd)7440-05-30.000181.000000.01842
subTotal0.01805100.000001.84156
total0.98015100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.