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Chemical content 74AUP1G3208GX

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Type numberPackagePackage descriptionTotal product weight
74AUP1G3208GXSOT1255-2X2SON60.75571 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935308466147612601235Seremban, Malaysia; Shanghai, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04510100.000005.96829
subTotal0.04510100.000005.96829
ComponentAdditiveNon hazardousProprietary0.000255.000000.03308
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.03308
Silica -amorphous-7631-86-90.0025050.000000.33081
PolymerEpoxy resin systemProprietary0.0015030.000000.19849
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.06616
subTotal0.00500100.000000.66162
Lead FrameCopper alloyCopper (Cu)7440-50-80.2740894.5100036.26775
Magnesium (Mg)7439-95-40.000440.150000.05756
Nickel (Ni)7440-02-00.008562.950001.13205
Silicon (Si)7440-21-30.001860.640000.24560
Pure metal layerGold (Au)7440-57-50.000060.020000.00767
Nickel (Ni)7440-02-00.004761.640000.62934
Palladium (Pd)7440-05-30.000260.090000.03454
subTotal0.29000100.0000038.37451
Mould CompoundAdditiveNon hazardousProprietary0.001630.410000.21593
FillerSilica -amorphous-7631-86-90.001150.290000.15273
Silica fused60676-86-00.3428886.1500045.37150
HardenerPhenolic resinProprietary0.017074.290002.25936
PigmentCarbon black1333-86-40.000760.190000.10006
PolymerEpoxy resin systemProprietary0.034518.670004.56612
subTotal0.39800100.0000052.66570
WireGold alloyGold (Au)7440-57-50.0174399.000002.30630
Palladium (Pd)7440-05-30.000181.000000.02330
subTotal0.01760100.000002.32960
total0.75571100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.