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Chemical content 74AUP1G374GM

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Type numberPackagePackage descriptionTotal product weight
74AUP1G374GMSOT886XSON61.95018 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352806241321412601235Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands 
9352806241151312601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped SiliconSilicon (Si)7440-21-30.09021100.000004.62552
subTotal0.09021100.000004.62552
ComponentAdditiveNon hazardousProprietary0.000255.000000.01282
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01282
Silica -amorphous-7631-86-90.0025050.000000.12819
PolymerEpoxy resin systemProprietary0.0015030.000000.07692
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02564
subTotal0.00500100.000000.25639
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100037.41281
Magnesium (Mg)7439-95-40.001160.150000.05938
Nickel (Ni)7440-02-00.022772.950001.16779
Silicon (Si)7440-21-30.004940.640000.25335
Pure metal layerGold (Au)7440-57-50.000150.020000.00792
Nickel (Ni)7440-02-00.012661.640000.64921
Palladium (Pd)7440-05-30.000690.090000.03563
subTotal0.77200100.0000039.58609
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22411
FillerSilica -amorphous-7631-86-90.003090.290000.15852
Silica fused60676-86-00.9183686.1500047.09099
HardenerPhenolic resinProprietary0.045734.290002.34498
PigmentCarbon black1333-86-40.002030.190000.10386
PolymerEpoxy resin systemProprietary0.092428.670004.73916
subTotal1.06600100.0000054.66162
WireGold alloyGold (Au)7440-57-50.0168199.000000.86173
Palladium (Pd)7440-05-30.000171.000000.00870
subTotal0.01698100.000000.87043
total1.95018100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.