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Chemical content 74AUP1G374GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AUP1G374GW-Q100SOT363-2SC-885.76992 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300212125712601235Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0073675.000000.12751
PolymerResin systemProprietary0.0024525.000000.04250
subTotal0.00981100.000000.17001
DieDoped siliconSilicon (Si)7440-21-30.12027100.000002.08451
subTotal0.12027100.000002.08451
Lead FrameCopper alloyCopper (Cu)7440-50-82.0433296.8400035.41339
Iron (Fe)7439-89-60.048742.310000.84474
Lead (Pb)7439-92-10.000210.010000.00366
Phosphorus (P)7723-14-00.001480.070000.02560
Zinc (Zn)7440-66-60.002530.120000.04388
Pure metal layerSilver (Ag)7440-22-40.013720.650000.23770
subTotal2.11000100.0000036.56897
Mould CompoundFillerSilica -amorphous-7631-86-90.4396014.000007.61882
Silica fused60676-86-02.2159070.5700038.40431
PigmentCarbon black1333-86-40.006280.200000.10884
PolymerEpoxy resin systemProprietary0.291719.290005.05563
Phenolic resinProprietary0.186525.940003.23256
subTotal3.14000100.0000054.42016
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00019
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00032
Tin solderTin (Sn)7440-31-50.3699699.990006.41193
subTotal0.37000100.000006.41256
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0198399.990000.34369
subTotal0.01983100.000000.34372
total5.76992100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.