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Chemical content 74AUP1G74GN

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Type numberPackagePackage descriptionTotal product weight
74AUP1G74GNSOT1116X2SON81.17831 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292215115912601235Seremban, Malaysia; Ayutthaya, Thailand; Shanghai, China; Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05068100.000004.30086
subTotal0.05068100.000004.30086
ComponentAdditiveNon hazardousProprietary0.000705.000000.05941
FillerBisphenol A-epichlorohydrin resin25068-38-60.000705.000000.05941
Silica -amorphous-7631-86-90.0070050.000000.59407
PolymerEpoxy resin systemProprietary0.0042030.000000.35644
Phenol Formaldehyde resin (generic)9003-35-40.0014010.000000.11881
subTotal0.01400100.000001.18814
Lead FrameCopper alloyCopper (Cu)7440-50-80.4728892.9033040.13187
Magnesium (Mg)7439-95-40.000740.144900.06259
Nickel (Ni)7440-02-00.014752.897201.25152
Silicon (Si)7440-21-30.003190.627700.27115
MetallisationGold (Au)7440-57-50.000210.042100.01819
Nickel (Ni)7440-02-00.016503.241801.40038
Palladium (Pd)7440-05-30.000730.143000.06177
subTotal0.50900100.0000043.19747
Mould CompoundAdditiveNon hazardousProprietary0.002380.410000.20216
FillerSilica -amorphous-7631-86-90.001680.290000.14299
Silica fused60676-86-00.5005386.1500042.47876
HardenerPhenolic resinProprietary0.024924.290002.11531
PigmentCarbon black1333-86-40.001100.190000.09369
PolymerEpoxy resin systemProprietary0.050378.670004.27500
subTotal0.58100100.0000049.30791
WireGold alloyGold (Au)7440-57-50.0234099.000001.98578
Palladium (Pd)7440-05-30.000241.000000.02006
subTotal0.02364100.000002.00584
total1.17831100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.