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Chemical content 74AUP1G74GS

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Type numberPackagePackage descriptionTotal product weight
74AUP1G74GSSOT1203X2SON81.34046 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292775115912601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China; Seremban, Malaysia; Shanghai, China; Ayutthaya, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05068100.000003.78061
subTotal0.05068100.000003.78061
ComponentAdditiveNon hazardousProprietary0.000305.000000.02238
FillerBisphenol A-epichlorohydrin resin25068-38-60.000305.000000.02238
Silica -amorphous-7631-86-90.0030050.000000.22380
PolymerEpoxy resin systemProprietary0.0018030.000000.13428
Phenol Formaldehyde resin (generic)9003-35-40.0006010.000000.04476
subTotal0.00600100.000000.44760
Lead FrameCopper alloyCopper (Cu)7440-50-80.5443894.5100040.61125
Magnesium (Mg)7439-95-40.000860.150000.06446
Nickel (Ni)7440-02-00.016992.950001.26762
Silicon (Si)7440-21-30.003690.640000.27501
Pure metal layerGold (Au)7440-57-50.000120.020000.00859
Nickel (Ni)7440-02-00.009451.640000.70471
Palladium (Pd)7440-05-30.000520.090000.03867
subTotal0.57600100.0000042.97031
Mould CompoundAdditiveNon hazardousProprietary0.002800.410000.20891
FillerSilica -amorphous-7631-86-90.001980.290000.14776
Silica fused60676-86-00.5884086.1500043.89571
HardenerPhenolic resinProprietary0.029304.290002.18587
PigmentCarbon black1333-86-40.001300.190000.09681
PolymerEpoxy resin systemProprietary0.059228.670004.41760
subTotal0.68300100.0000050.95266
WireGold alloyGold (Au)7440-57-50.0245399.000001.83013
Palladium (Pd)7440-05-30.000251.000000.01849
subTotal0.02478100.000001.84862
total1.34046100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.