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Chemical content 74AUP1T08GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AUP1T08GW-Q100SOT353-1UMT55.66851 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691180125512601235Bangkok, Thailand; Seremban, Malaysia; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.12861
PolymerResin systemProprietary0.0024325.000000.04287
subTotal0.00972100.000000.17148
DieDoped siliconSilicon (Si)7440-21-30.07216100.000001.27292
subTotal0.07216100.000001.27292
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400033.65519
Iron (Fe)7439-89-60.045512.310000.80280
Lead (Pb)7439-92-10.000200.010000.00348
Phosphorus (P)7723-14-00.001380.070000.02433
Zinc (Zn)7440-66-60.002360.120000.04170
Pure metal layerSilver (Ag)7440-22-40.012800.650000.22590
subTotal1.97000100.0000034.75340
Mould CompoundFillerSilica -amorphous-7631-86-90.4606014.000008.12559
Silica fused60676-86-02.3217570.5700040.95879
PigmentCarbon black1333-86-40.006580.200000.11608
PolymerEpoxy resin systemProprietary0.305649.290005.39191
Phenolic resinProprietary0.195435.940003.44757
subTotal3.29000100.0000058.03994
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00016
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00027
Tin solderTin (Sn)7440-31-50.3099799.990005.46826
subTotal0.31000100.000005.46879
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0166399.990000.29338
subTotal0.01663100.000000.29341
total5.66851100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.