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Chemical content 74AUP1T34GM

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Type numberPackagePackage descriptionTotal product weight
74AUP1T34GMSOT886XSON61.88733 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352805171321112601235Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands 
9352805171151312601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02351100.000001.24581
subTotal0.02351100.000001.24581
ComponentAdditiveNon hazardousProprietary0.000255.000000.01325
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01325
Silica -amorphous-7631-86-90.0025050.000000.13246
PolymerEpoxy resin systemProprietary0.0015030.000000.07948
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02649
subTotal0.00500100.000000.26493
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100038.65870
Magnesium (Mg)7439-95-40.001160.150000.06136
Nickel (Ni)7440-02-00.022772.950001.20668
Silicon (Si)7440-21-30.004940.640000.26179
Pure metal layerGold (Au)7440-57-50.000150.020000.00818
Nickel (Ni)7440-02-00.012661.640000.67083
Palladium (Pd)7440-05-30.000690.090000.03681
subTotal0.77200100.0000040.90435
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.23158
FillerSilica -amorphous-7631-86-90.003090.290000.16380
Silica fused60676-86-00.9183686.1500048.65916
HardenerPhenolic resinProprietary0.045734.290002.42307
PigmentCarbon black1333-86-40.002030.190000.10732
PolymerEpoxy resin systemProprietary0.092428.670004.89698
subTotal1.06600100.0000056.48191
WireGold alloyGold (Au)7440-57-50.0206199.000001.09211
Palladium (Pd)7440-05-30.000211.000000.01103
subTotal0.02082100.000001.10314
total1.88733100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.