Chemical content 74AUP1T34GM

As a proactive and sustainable company, Nexperia has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Nexperia has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Nexperia products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type numberPackagePackage descriptionTotal product weight
74AUP1T34GMSOT886XSON62.00785 mg
12NCEffectiveVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352 805 171152018-11-1210126030 s124020 s3Seremban, Malaysia 
9352 805 171322018-11-128126030 s124020 s3Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04703100.000002.34207
subTotal0.04703100.000002.34207
ComponentAdditiveNon hazardousProprietary0.001005.000000.04981
FillerAluminium Trioxide (Al2O3)1344-28-10.0080040.000000.39844
PolymerBisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0030015.000000.14941
Bisphenol-A/Epichlorohydrin Epoxy resin (generic)25068-38-60.0020010.000000.09961
Resin systemProprietary0.0060030.000000.29883
subTotal0.02000100.000000.99609
Lead FrameCopper alloyCopper (Cu)7440-50-81.0180693.4000050.70411
Magnesium (Mg)7439-95-40.001640.150000.08143
Nickel (Ni) - cas no. 7440-02-07440-02-00.030082.760001.49832
Silicon (Si)7440-21-30.006870.630000.34201
Pure metal layerGold (Au)7440-57-50.000440.040000.02172
Nickel (Ni) - cas no. 7440-02-07440-02-00.031722.910001.57975
Palladium (Pd)7440-05-30.001200.110000.05972
subTotal1.09000100.0000054.28705
Mould CompoundFillerSilica -amorphous-7631-86-90.1600020.000007.96874
Silica fused60676-86-00.5160064.5000025.69919
Flame retardantMetal hydroxideProprietary0.024003.000001.19531
ImpuritySilicon Dioxide (SiO2)14808-60-70.004000.500000.19922
PigmentCarbon black1333-86-40.002400.300000.11953
PolymerPhenol Formaldehyde resin (generic)9003-35-40.017602.200000.87656
Phenolic resinProprietary0.020002.500000.99609
Tetramethylbiphenyl diglycidyl ether85954-11-60.056007.000002.78906
subTotal0.80000100.0000039.84371
Post-platingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0300099.990001.49399
subTotal0.03000100.000001.49414
WireGold alloyGold (Au)7440-57-50.0206199.000001.02656
Palladium (Pd)7440-05-30.000211.000000.01037
subTotal0.02082100.000001.03693
total2.00785100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

China RoHS Information

Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Die
晶粒
OOOOOO
Component
元器件
OOOOOO
Lead Frame
引线框
OOOOOO
Mould Compound
注塑胶料
OOOOOO
Post-plating
后电镀
OOOOOO
Wire
线
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Nexperia products have an environmental friendly use period (EFUP) of 50 years.
disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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