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Chemical content 74AUP1T34GS

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Type numberPackagePackage descriptionTotal product weight
74AUP1T34GSSOT1202X2SON60.95473 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292876132612601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02351100.000002.46275
subTotal0.02351100.000002.46275
ComponentAdditiveNon hazardousProprietary0.000255.000000.02619
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02619
Silica -amorphous-7631-86-90.0025050.000000.26185
PolymerEpoxy resin systemProprietary0.0015030.000000.15711
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05237
subTotal0.00500100.000000.52371
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100041.67535
Magnesium (Mg)7439-95-40.000630.150000.06614
Nickel (Ni)7440-02-00.012422.950001.30084
Silicon (Si)7440-21-30.002690.640000.28222
Pure metal layerGold (Au)7440-57-50.000080.020000.00882
Nickel (Ni)7440-02-00.006901.640000.72318
Palladium (Pd)7440-05-30.000380.090000.03969
subTotal0.42100100.0000044.09624
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.21086
FillerSilica -amorphous-7631-86-90.001420.290000.14914
Silica fused60676-86-00.4230086.1500044.30535
HardenerPhenolic resinProprietary0.021064.290002.20627
PigmentCarbon black1333-86-40.000930.190000.09771
PolymerEpoxy resin systemProprietary0.042578.670004.45882
subTotal0.49100100.0000051.42815
WireGold alloyGold (Au)7440-57-50.0140899.000001.47453
Palladium (Pd)7440-05-30.000141.000000.01489
subTotal0.01422100.000001.48942
total0.95473100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.