×

Chemical content 74AUP1T34GW-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP1T34GW-Q100SOT353-1UMT55.70565 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935302098125612601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.12777
PolymerResin systemProprietary0.0024325.000000.04259
subTotal0.00972100.000000.17036
DieDoped siliconSilicon (Si)7440-21-30.11219100.000001.96629
subTotal0.11219100.000001.96629
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400033.43612
Iron (Fe)7439-89-60.045512.310000.79758
Lead (Pb)7439-92-10.000200.010000.00345
Phosphorus (P)7723-14-00.001380.070000.02417
Zinc (Zn)7440-66-60.002360.120000.04143
Pure metal layerSilver (Ag)7440-22-40.012800.650000.22443
subTotal1.97000100.0000034.52718
Mould CompoundFillerSilica -amorphous-7631-86-90.4606014.000008.07270
Silica fused60676-86-02.3217570.5700040.69217
PigmentCarbon black1333-86-40.006580.200000.11532
PolymerEpoxy resin systemProprietary0.305649.290005.35681
Phenolic resinProprietary0.195435.940003.42513
subTotal3.29000100.0000057.66213
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00016
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00027
Tin solderTin (Sn)7440-31-50.3099799.990005.43267
subTotal0.31000100.000005.43320
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0137499.990000.24078
subTotal0.01374100.000000.24080
total5.70565100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.