×

Chemical content 74AUP1T34GX

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP1T34GXSOT1226-3X2SON50.60572 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935302887125712601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02351100.000003.88176
subTotal0.02351100.000003.88176
ComponentAdditiveNon hazardousProprietary0.000205.000000.03302
FillerBisphenol A-epichlorohydrin resin25068-38-60.000205.000000.03302
Silica -amorphous-7631-86-90.0020050.000000.33019
PolymerEpoxy resin systemProprietary0.0012030.000000.19811
Phenol Formaldehyde resin (generic)9003-35-40.0004010.000000.06604
subTotal0.00400100.000000.66038
Lead FrameCopper alloyCopper (Cu)7440-50-80.2391194.5100039.47538
Magnesium (Mg)7439-95-40.000380.150000.06265
Nickel (Ni)7440-02-00.007462.950001.23217
Silicon (Si)7440-21-30.001620.640000.26732
Pure metal layerGold (Au)7440-57-50.000050.020000.00835
Nickel (Ni)7440-02-00.004151.640000.68500
Palladium (Pd)7440-05-30.000230.090000.03759
subTotal0.25300100.0000041.76846
Mould CompoundAdditiveNon hazardousProprietary0.001280.410000.21119
FillerSilica -amorphous-7631-86-90.000900.290000.14938
Silica fused60676-86-00.2687986.1500044.37496
HardenerPhenolic resinProprietary0.013384.290002.20973
PigmentCarbon black1333-86-40.000590.190000.09787
PolymerEpoxy resin systemProprietary0.027058.670004.46583
subTotal0.31200100.0000051.50896
WireGold alloyGold (Au)7440-57-50.0130899.000002.15907
Palladium (Pd)7440-05-30.000131.000000.02181
subTotal0.01321100.000002.18088
total0.60572100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.