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Chemical content 74AUP1T45GM

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Type numberPackagePackage descriptionTotal product weight
74AUP1T45GMSOT886XSON61.95232 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352805141321512601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
9352805141151212601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped SiliconSilicon (Si)7440-21-30.08414100.000004.30985
subTotal0.08414100.000004.30985
ComponentAdditiveNon hazardousProprietary0.000255.000000.01281
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01281
Silica -amorphous-7631-86-90.0025050.000000.12805
PolymerEpoxy resin systemProprietary0.0015030.000000.07683
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02561
subTotal0.00500100.000000.25611
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100037.37180
Magnesium (Mg)7439-95-40.001160.150000.05931
Nickel (Ni)7440-02-00.022772.950001.16651
Silicon (Si)7440-21-30.004940.640000.25307
Pure metal layerGold (Au)7440-57-50.000150.020000.00791
Nickel (Ni)7440-02-00.012661.640000.64850
Palladium (Pd)7440-05-30.000690.090000.03559
subTotal0.77200100.0000039.54269
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22387
FillerSilica -amorphous-7631-86-90.003090.290000.15834
Silica fused60676-86-00.9183686.1500047.03937
HardenerPhenolic resinProprietary0.045734.290002.34241
PigmentCarbon black1333-86-40.002030.190000.10374
PolymerEpoxy resin systemProprietary0.092428.670004.73397
subTotal1.06600100.0000054.60170
WireGold alloyGold (Au)7440-57-50.0249299.000001.27660
Palladium (Pd)7440-05-30.000251.000000.01289
subTotal0.02518100.000001.28949
total1.95232100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.