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Chemical content 74AUP1T45GS

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Type numberPackagePackage descriptionTotal product weight
74AUP1T45GSSOT1202X2SON60.97694 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292877132512601235Bangkok, Thailand; Seremban, Malaysia; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04207100.000004.30641
subTotal0.04207100.000004.30641
ComponentAdditiveNon hazardousProprietary0.000255.000000.02559
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02559
Silica -amorphous-7631-86-90.0025050.000000.25590
PolymerEpoxy resin systemProprietary0.0015030.000000.15354
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05118
subTotal0.00500100.000000.51180
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100040.72790
Magnesium (Mg)7439-95-40.000630.150000.06464
Nickel (Ni)7440-02-00.012422.950001.27127
Silicon (Si)7440-21-30.002690.640000.27580
Pure metal layerGold (Au)7440-57-50.000080.020000.00862
Nickel (Ni)7440-02-00.006901.640000.70674
Palladium (Pd)7440-05-30.000380.090000.03878
subTotal0.42100100.0000043.09375
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.20606
FillerSilica -amorphous-7631-86-90.001420.290000.14575
Silica fused60676-86-00.4230086.1500043.29810
HardenerPhenolic resinProprietary0.021064.290002.15611
PigmentCarbon black1333-86-40.000930.190000.09549
PolymerEpoxy resin systemProprietary0.042578.670004.35745
subTotal0.49100100.0000050.25896
WireGold alloyGold (Au)7440-57-50.0176999.000001.81038
Palladium (Pd)7440-05-30.000181.000000.01829
subTotal0.01786100.000001.82867
total0.97694100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.