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Chemical content 74AUP2G00GX

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Type numberPackagePackage descriptionTotal product weight
74AUP2G00GXSOT1233-2X2SON81.05102 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935308439115612601235Seremban, Malaysia; Ayutthaya, Thailand; Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05068100.000004.82174
subTotal0.05068100.000004.82174
ComponentAdditiveNon hazardousProprietary0.000255.000000.02379
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02379
Silica -amorphous-7631-86-90.0025050.000000.23786
PolymerEpoxy resin systemProprietary0.0015030.000000.14272
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.04757
subTotal0.00500100.000000.47573
Lead FrameCopper alloyCopper (Cu)7440-50-80.3865594.5100036.77817
Magnesium (Mg)7439-95-40.000610.150000.05837
Nickel (Ni)7440-02-00.012072.950001.14798
Silicon (Si)7440-21-30.002620.640000.24905
Pure metal layerGold (Au)7440-57-50.000080.020000.00778
Nickel (Ni)7440-02-00.006711.640000.63820
Palladium (Pd)7440-05-30.000370.090000.03502
subTotal0.40900100.0000038.91457
Mould CompoundAdditiveNon hazardousProprietary0.002300.410000.21923
FillerSilica -amorphous-7631-86-90.001630.290000.15507
Silica fused60676-86-00.4841686.1500046.06601
HardenerPhenolic resinProprietary0.024114.290002.29394
PigmentCarbon black1333-86-40.001070.190000.10160
PolymerEpoxy resin systemProprietary0.048738.670004.63601
subTotal0.56200100.0000053.47186
WireGold alloyGold (Au)7440-57-50.0241099.000002.29316
Palladium (Pd)7440-05-30.000241.000000.02316
subTotal0.02434100.000002.31632
total1.05102100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.