Chemical content 74AUP2G132GN

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Type numberPackagePackage descriptionTotal product weight
74AUP2G132GNSOT1116X2SON81.17843 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352922221156126030 s123520 s3Nijmegen, Netherlands; Bangkok, Thailand; Ayutthaya, Thailand; Seremban, Malaysia; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05068100.000004.30043
ComponentAdditiveNon hazardousProprietary0.000705.000000.05940
FillerBisphenol A-epichlorohydrin resin25068-38-60.000705.000000.05940
Silica -amorphous-7631-86-90.0070050.000000.59401
PolymerEpoxy resin systemProprietary0.0042030.000000.35641
Phenol Formaldehyde resin (generic)9003-35-40.0014010.000000.11880
Lead FrameCopper alloyCopper (Cu)7440-50-80.4728892.9033040.12778
Magnesium (Mg)7439-95-40.000740.144900.06259
Nickel (Ni)7440-02-00.014752.897201.25139
Silicon (Si)7440-21-30.003190.627700.27112
MetallisationGold (Au)7440-57-50.000210.042100.01818
Nickel (Ni)7440-02-00.016503.241801.40023
Palladium (Pd)7440-05-30.000730.143000.06177
Mould CompoundAdditiveNon hazardousProprietary0.002380.410000.20214
FillerSilica -amorphous-7631-86-90.001680.290000.14298
Silica fused60676-86-00.5005386.1500042.47444
HardenerPhenolic resinProprietary0.024924.290002.11509
PigmentCarbon black1333-86-40.001100.190000.09368
PolymerEpoxy resin systemProprietary0.050378.670004.27456
WireGold alloyGold (Au)7440-57-50.0235299.000001.99566
Palladium (Pd)7440-05-30.000241.000000.02016
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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