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Chemical content 74AUP2G57DP

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Type numberPackagePackage descriptionTotal product weight
74AUP2G57DPSOT552-1TSSOP1023.35111 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935304471118612601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.7209080.100003.08722
PolymerResin systemProprietary0.1791019.900000.76699
subTotal0.90000100.000003.85421
DieDoped siliconSilicon (Si)7440-21-30.13085100.000000.56037
subTotal0.13085100.000000.56037
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.8950797.4700033.81026
Iron (Fe)7439-89-60.194402.400000.83251
Phosphorus (P)7723-14-00.002430.030000.01041
Zinc (Zn)7440-66-60.008100.100000.03469
subTotal8.10000100.0000034.68787
Mould CompoundFillerMisc. Silica compounds (generic)14808-60-711.5050088.5000049.26961
Flame retardantNon hazardousProprietary0.390003.000001.67016
PolymerEpoxy resin systemProprietary1.105008.500004.73211
subTotal13.00000100.0000055.67188
Pre-PlatingPure metal layerGold (Au)7440-57-50.011001.000000.04711
Nickel (Ni)7440-02-01.0670097.000004.56938
Palladium (Pd)7440-05-30.022002.000000.09421
subTotal1.10000100.000004.71070
WirePure metalGold (Au)7440-57-50.1190599.000000.50984
Palladium (Pd)7440-05-30.001201.000000.00515
subTotal0.12026100.000000.51499
total23.35111100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.