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Chemical content 74AUP2G80GN

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Type numberPackagePackage descriptionTotal product weight
74AUP2G80GNSOT1116X2SON81.17843 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292229115612601235Seremban, Malaysia; Suzhou, China; Bangkok, Thailand; Ayutthaya, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05068100.000004.30043
subTotal0.05068100.000004.30043
ComponentAdditiveNon hazardousProprietary0.000705.000000.05940
FillerBisphenol A-epichlorohydrin resin25068-38-60.000705.000000.05940
Silica -amorphous-7631-86-90.0070050.000000.59401
PolymerEpoxy resin systemProprietary0.0042030.000000.35641
Phenol Formaldehyde resin (generic)9003-35-40.0014010.000000.11880
subTotal0.01400100.000001.18802
Lead FrameCopper alloyCopper (Cu)7440-50-80.4728892.9033040.12778
Magnesium (Mg)7439-95-40.000740.144900.06259
Nickel (Ni)7440-02-00.014752.897201.25139
Silicon (Si)7440-21-30.003190.627700.27112
MetallisationGold (Au)7440-57-50.000210.042100.01818
Nickel (Ni)7440-02-00.016503.241801.40023
Palladium (Pd)7440-05-30.000730.143000.06177
subTotal0.50900100.0000043.19306
Mould CompoundAdditiveNon hazardousProprietary0.002380.410000.20214
FillerSilica -amorphous-7631-86-90.001680.290000.14298
Silica fused60676-86-00.5005386.1500042.47444
HardenerPhenolic resinProprietary0.024924.290002.11509
PigmentCarbon black1333-86-40.001100.190000.09368
PolymerEpoxy resin systemProprietary0.050378.670004.27456
subTotal0.58100100.0000049.30289
WireGold alloyGold (Au)7440-57-50.0235299.000001.99566
Palladium (Pd)7440-05-30.000241.000000.02016
subTotal0.02376100.000002.01582
total1.17843100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.