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Chemical content 74AVC1T45GM-Q100

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Type numberPackagePackage descriptionTotal product weight
74AVC1T45GM-Q100SOT886XSON61.96571 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352994891251312601235Hefei, China; Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.09527100.000004.84678
subTotal0.09527100.000004.84678
ComponentAdditiveNon hazardousProprietary0.000255.000000.01272
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01272
Silica -amorphous-7631-86-90.0025050.000000.12718
PolymerEpoxy resin systemProprietary0.0015030.000000.07631
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02544
subTotal0.00500100.000000.25437
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100037.11723
Magnesium (Mg)7439-95-40.001160.150000.05891
Nickel (Ni)7440-02-00.022772.950001.15856
Silicon (Si)7440-21-30.004940.640000.25135
Pure metal layerGold (Au)7440-57-50.000150.020000.00785
Nickel (Ni)7440-02-00.012661.640000.64408
Palladium (Pd)7440-05-30.000690.090000.03535
subTotal0.77200100.0000039.27333
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22234
FillerSilica -amorphous-7631-86-90.003090.290000.15727
Silica fused60676-86-00.9183686.1500046.71895
HardenerPhenolic resinProprietary0.045734.290002.32646
PigmentCarbon black1333-86-40.002030.190000.10304
PolymerEpoxy resin systemProprietary0.092428.670004.70172
subTotal1.06600100.0000054.22978
WireGold alloyGold (Au)7440-57-50.0271699.000001.38172
Palladium (Pd)7440-05-30.000271.000000.01396
subTotal0.02744100.000001.39568
total1.96571100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.