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Chemical content 74AVC1T45GX

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Type numberPackagePackage descriptionTotal product weight
74AVC1T45GXSOT1255-2X2SON60.75749 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935308468147812601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04764100.000006.28878
subTotal0.04764100.000006.28878
ComponentAdditiveNon hazardousProprietary0.000255.000000.03300
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.03300
Silica -amorphous-7631-86-90.0025050.000000.33004
PolymerEpoxy resin systemProprietary0.0015030.000000.19802
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.06601
subTotal0.00500100.000000.66007
Lead FrameCopper alloyCopper (Cu)7440-50-80.2740894.5100036.18252
Magnesium (Mg)7439-95-40.000440.150000.05743
Nickel (Ni)7440-02-00.008562.950001.12939
Silicon (Si)7440-21-30.001860.640000.24502
Pure metal layerGold (Au)7440-57-50.000060.020000.00766
Nickel (Ni)7440-02-00.004761.640000.62786
Palladium (Pd)7440-05-30.000260.090000.03446
subTotal0.29000100.0000038.28434
Mould CompoundAdditiveNon hazardousProprietary0.001630.410000.21542
FillerSilica -amorphous-7631-86-90.001150.290000.15237
Silica fused60676-86-00.3428886.1500045.26489
HardenerPhenolic resinProprietary0.017074.290002.25405
PigmentCarbon black1333-86-40.000760.190000.09983
PolymerEpoxy resin systemProprietary0.034518.670004.55539
subTotal0.39800100.0000052.54195
WireGold alloyGold (Au)7440-57-50.0166899.000002.20221
Palladium (Pd)7440-05-30.000171.000000.02224
subTotal0.01685100.000002.22445
total0.75749100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.