Chemical content 74AVC1T8832GS

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Type numberPackagePackage descriptionTotal product weight
74AVC1T8832GSSOT1203X2SON81.33366 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935690694115612601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04764100.000003.57189
ComponentAdditiveNon hazardousProprietary0.000305.000000.02249
FillerBisphenol A-epichlorohydrin resin25068-38-60.000305.000000.02249
Silica -amorphous-7631-86-90.0030050.000000.22494
PolymerEpoxy resin systemProprietary0.0018030.000000.13497
Phenol Formaldehyde resin (generic)9003-35-40.0006010.000000.04499
Lead FrameCopper alloyCopper (Cu)7440-50-80.5443894.5100040.81832
Magnesium (Mg)7439-95-40.000860.150000.06478
Nickel (Ni)7440-02-00.016992.950001.27409
Silicon (Si)7440-21-30.003690.640000.27641
Pure metal layerGold (Au)7440-57-50.000120.020000.00864
Nickel (Ni)7440-02-00.009451.640000.70831
Palladium (Pd)7440-05-30.000520.090000.03887
Mould CompoundAdditiveNon hazardousProprietary0.002800.410000.20997
FillerSilica -amorphous-7631-86-90.001980.290000.14852
Silica fused60676-86-00.5884086.1500044.11953
HardenerPhenolic resinProprietary0.029304.290002.19701
PigmentCarbon black1333-86-40.001300.190000.09730
PolymerEpoxy resin systemProprietary0.059228.670004.44012
WireGold alloyGold (Au)7440-57-50.0208199.000001.56072
Palladium (Pd)7440-05-30.000211.000000.01576
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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