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Chemical content 74AVC1T8832GS

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Type numberPackagePackage descriptionTotal product weight
74AVC1T8832GSSOT1203X2SON81.33366 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690694115612601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04764100.000003.57189
subTotal0.04764100.000003.57189
ComponentAdditiveNon hazardousProprietary0.000305.000000.02249
FillerBisphenol A-epichlorohydrin resin25068-38-60.000305.000000.02249
Silica -amorphous-7631-86-90.0030050.000000.22494
PolymerEpoxy resin systemProprietary0.0018030.000000.13497
Phenol Formaldehyde resin (generic)9003-35-40.0006010.000000.04499
subTotal0.00600100.000000.44988
Lead FrameCopper alloyCopper (Cu)7440-50-80.5443894.5100040.81832
Magnesium (Mg)7439-95-40.000860.150000.06478
Nickel (Ni)7440-02-00.016992.950001.27409
Silicon (Si)7440-21-30.003690.640000.27641
Pure metal layerGold (Au)7440-57-50.000120.020000.00864
Nickel (Ni)7440-02-00.009451.640000.70831
Palladium (Pd)7440-05-30.000520.090000.03887
subTotal0.57600100.0000043.18942
Mould CompoundAdditiveNon hazardousProprietary0.002800.410000.20997
FillerSilica -amorphous-7631-86-90.001980.290000.14852
Silica fused60676-86-00.5884086.1500044.11953
HardenerPhenolic resinProprietary0.029304.290002.19701
PigmentCarbon black1333-86-40.001300.190000.09730
PolymerEpoxy resin systemProprietary0.059228.670004.44012
subTotal0.68300100.0000051.21245
WireGold alloyGold (Au)7440-57-50.0208199.000001.56072
Palladium (Pd)7440-05-30.000211.000000.01576
subTotal0.02103100.000001.57648
total1.33366100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.