×

Chemical content 74AVC20T245DGG

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AVC20T245DGGSOT364-1TSSOP56231.55505 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352862351181212601235Bangkok, Thailand; Nijmegen, Netherlands; Shanghai, China; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1947577.900000.08411
PolymerAcrylic resinProprietary0.0380015.200000.01641
Resin systemProprietary0.017256.900000.00745
subTotal0.25000100.000000.10797
DieDoped siliconSilicon (Si)7440-21-31.80297100.000000.77864
subTotal1.80297100.000000.77864
Lead FrameCopper alloyCopper (Cu)7440-50-887.7275994.5850037.88628
Magnesium (Mg)7439-95-40.159530.172000.06890
Silicon (Si)7440-21-30.660840.712500.28539
Pure metal layerGold (Au)7440-57-50.027360.029500.01182
Nickel (Ni)7440-02-04.109294.430501.77465
Palladium (Pd)7440-05-30.045450.049000.01963
Silver (Ag)7440-22-40.019940.021500.00861
subTotal92.75000100.0000040.05528
Mould CompoundAdditiveNon hazardousProprietary6.406104.700002.76656
FillerSilica fused60676-86-0107.6770079.0000046.50169
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-88.178006.000003.53177
PigmentCarbon black1333-86-40.272600.200000.11773
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-65.452004.000002.35452
Non hazardousProprietary5.588304.100002.41338
Tetramethylbiphenyl diglycidyl ether85954-11-62.726002.000001.17726
subTotal136.30000100.0000058.86291
WirePure metalCopper (Cu)7440-50-80.45208100.000000.19524
subTotal0.45208100.000000.19524
total231.55505100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.