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Chemical content 74AVC2T45GT

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Type numberPackagePackage descriptionTotal product weight
74AVC2T45GTSOT833-1XSON82.50340 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352837151151912601235Nijmegen, Netherlands; Seremban, Malaysia; Shanghai, China; Ayutthaya, Thailand; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.09527100.000003.80577
subTotal0.09527100.000003.80577
ComponentAdditiveNon hazardousProprietary0.000755.000000.02996
FillerBisphenol A-epichlorohydrin resin25068-38-60.000755.000000.02996
Silica -amorphous-7631-86-90.0075050.000000.29959
PolymerEpoxy resin systemProprietary0.0045030.000000.17976
Phenol Formaldehyde resin (generic)9003-35-40.0015010.000000.05992
subTotal0.01500100.000000.59919
Lead FrameCopper alloyCopper (Cu)7440-50-80.9839493.4419039.30427
Magnesium (Mg)7439-95-40.001530.145700.06129
Nickel (Ni)7440-02-00.030682.914001.22571
Silicon (Si)7440-21-30.006650.631400.26558
Pure metal layerGold (Au)7440-57-50.000370.035000.01472
Nickel (Ni)7440-02-00.028562.712001.14074
Palladium (Pd)7440-05-30.001260.120000.05048
subTotal1.05300100.0000042.06279
Mould CompoundAdditiveNon hazardousProprietary0.005340.410000.21324
FillerSilica -amorphous-7631-86-90.003780.290000.15083
Silica fused60676-86-01.1216786.1500044.80598
HardenerPhenolic resinProprietary0.055864.290002.23120
PigmentCarbon black1333-86-40.002470.190000.09882
PolymerEpoxy resin systemProprietary0.112888.670004.50920
subTotal1.30200100.0000052.00927
WireGold alloyGold (Au)7440-57-50.0377499.000001.50770
Palladium (Pd)7440-05-30.000381.000000.01523
subTotal0.03812100.000001.52293
total2.50340100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.