Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AVC4T245GU

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AVC4T245GUSOT1161-1XQFN165.865454 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352941321843126030 s123520 s3
9352941321158126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.01107060.0000000.188732
ImpurityNon hazardousProprietary0.0000070.0395000.000124
PolymerResin systemProprietary0.00737139.9514100.125669
subTotal0.018450100.0000000.314525
DieDoped siliconSilicon (Si)7440-21-30.160980100.0000002.744539
subTotal0.160980100.0000002.744539
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-82.80441697.00000047.812420
Nickel (Ni)7440-02-00.0867343.0000001.478735
subTotal2.891150100.00000049.291155
Mould CompoundAdditiveNon hazardousProprietary0.0753472.9840001.284588
FillerSilica -amorphous-7631-86-90.0881243.4900001.502416
Silica fused60676-86-02.14173084.82000036.514317
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.0253011.0020000.431353
PigmentCarbon black1333-86-40.0041410.1640000.070601
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.0934513.7010001.593250
Epoxy resin systemProprietary0.0400471.5860000.682760
Phenolic resinProprietary0.0568892.2530000.969898
subTotal2.525030100.00000043.049183
Pre-PlatingPure metal layerGold (Au)7440-57-50.0015541.0000000.026489
Nickel (Ni)7440-02-00.14138791.0000002.410499
Palladium (Pd)7440-05-30.0124308.0000000.211912
subTotal0.155370100.0000002.648900
WirePure metalGold (Au)7440-57-50.11332999.0000001.932148
Palladium (Pd)7440-05-30.0011451.0000000.019517
subTotal0.114474100.0000001.951665
total5.865454100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.