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Chemical content 74AVC4TD245BQ

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Type numberPackagePackage descriptionTotal product weight
74AVC4TD245BQSOT763-1DHVQFN1621.99988 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935294167115912601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29492
PolymerResin systemProprietary0.0161219.900000.07327
subTotal0.08100100.000000.36819
DieDoped siliconSilicon (Si)7440-21-30.30924100.000001.40563
subTotal0.30924100.000001.40563
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.63846
Iron (Fe)7439-89-60.237082.320001.07765
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03716
Zinc (Zn)7440-66-60.012260.120000.05574
Gold alloyGold (Au)7440-57-50.003060.029970.01392
Silver (Ag)7440-22-40.002040.019980.00928
ImpurityNon hazardousProprietary0.000130.001280.00059
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02320
Nickel (Ni)7440-02-00.130671.278720.59397
subTotal10.21900100.0000046.45020
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.49707
FillerSilica -amorphous-7631-86-90.395003.490001.79546
Silica fused60676-86-09.5999384.8200043.63627
PigmentCarbon black1333-86-40.018110.160000.08231
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55561
Epoxy resin systemProprietary0.179961.590000.81799
Phenolic resinProprietary0.254662.250001.15753
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.90349
subTotal11.31800100.0000051.44573
WirePure metalCopper (Cu)7440-50-80.0701496.550000.31882
Pure metal layerGold (Au)7440-57-50.000250.350000.00116
Palladium (Pd)7440-05-30.002253.100000.01024
subTotal0.07265100.000000.33022
total21.99988100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.